lundi 6 avril 2009

2009 PLACE Flexible Packaging Summit

The Flexible Packaging Industry will converge April 28-30, 2009 in Columbus, Ohio, USA for the 2009 TAPPI PLACE (Polymers, Laminations, Adhesives, Coatings and Extrusions) Flexible Packaging Summit. The event will include the two-day Consumer Packaging Solutions for Barrier Performance Course and the Symposium on Nanomaterials for Flexible Packaging.

View Summit Brochure.

I will attend the symposium to give a speech entitled: “Printed Intelligence in Packaging: Current and Potential Applications of Nanotechnology

Food safety and counterfeiting: Could Nano-Printed Intelligent Packaging be a Solution?

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